US Patent Issued to SAMSUNG ELECTRONICS on April 29 for "Semiconductor device package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,738, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device package and method of fabricating the same" was invented by Younghwan Park (Seongnam-si, South Korea), Jongseob Kim (Seoul, South Korea), Jaejoon Oh (Seongnam-si, South Korea), Soogine Chong (Seoul, South Korea) and Sunkyu Hwang (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device package and/or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of th...