US Patent Issued to SAMSUNG ELECTRONICS on April 29 for "Semiconductor chip with signal bump and dummy bump, semiconductor package including the semiconductor chip and method for manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,762, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor chip with signal bump and dummy bump, semiconductor package including the semiconductor chip and method for manufacturing the semiconductor package" was invented by Keum Hee Ma (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element layer including a semiconductor substrate including a bump area and a dummy bump area. A TSV structure is in the bump area and vertically extends through the semiconductor substrate, a first topmost line is in the bump area and on the TSV structure and el...