US Patent Issued to SAMSUNG ELECTRONICS on April 29 for "Integrated circuit device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,805, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Integrated circuit device and method of manufacturing the same" was invented by Jinbum Kim (Seoul, South Korea), Gyeom Kim (Hwaseong-si, South Korea), Hyojin Kim (Hwaseong-si, South Korea), Haejun Yu (Osan-si, South Korea), Seunghun Lee (Hwaseong-si, South Korea) and Kyungin Choi (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device is provided and includes: a fin-type active region extending in a first horizontal direction on a substrate, a channel region on the fin-type active region, a gate line surrounding the ...