US Patent Issued to SAMSUNG ELECTRONICS on April 29 for "Integrated circuit chip including gate electrode with oblique cut surface, and manufacturing method of the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,749, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Integrated circuit chip including gate electrode with oblique cut surface, and manufacturing method of the same" was invented by Inyeal Lee (Seongnam-si, South Korea), Dongbeen Kim (Suwon-si, South Korea), Jinwook Kim (Hwaseong-si, South Korea), Juhun Park (Seoul, South Korea), Deokhan Bae (Suwon-si, South Korea), Junghoon Seo (Hwaseong-si, South Korea) and Myungyoon Um (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit chip including a substrate, first and second channel active regions on the substrate, and extending in a firs...