ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,765, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices" was invented by Kunmo Chu (Seoul, South Korea), Byonggwon Song (Seoul, South Korea) and Junghoon Lee (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a hybrid bonding structure, a solder paste composition, a semiconductor device, and a method of manufacturing the semiconductor device. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste...