US Patent Issued to SAMSUNG ELECTRONICS on April 22 for "Wafer defect test apparatus, wafer defect test system, wafer test method and fabrication method of a wafer" (South Korean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,317, issued on April 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Wafer defect test apparatus, wafer defect test system, wafer test method and fabrication method of a wafer" was invented by Sung Hee Lee (Osan-si, South Korea), Jae Yoon Kim (Seoul, South Korea), Jung Hwan Moon (Seoul, South Korea), Jung Hoon Bak (Suwon-si, South Korea), Kyu-Baik Chang (Seoul, South Korea), Jae Hoon Jeong (Hwaseong-si, South Korea) and Min Kyoung Joo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer defect test apparatus in which a defect prediction performance is improved and a simulation time is shortened is provided. The ...