US Patent Issued to SAMSUNG ELECTRONICS on April 22 for "Substrate transfer device and substrate transfer method" (South Korean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,502, issued on April 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate transfer device and substrate transfer method" was invented by Young Wook Kim (Seoul, South Korea), Sang Min Kim (Hwaseong-si, South Korea), Ji Hun Kim (Uiwang-si, South Korea), Gi-Nam Park (Incheon, South Korea), Chul-Jun Park (Seoul, South Korea), Yong-Jun Ahn (Suwon-si, South Korea), Youn Gon Oh (Hwaseong-si, South Korea), Byung Kook Yoo (Hwaseong-si, South Korea), Hyun Woo Lee (Hwaseong-si, South Korea) and Jeong Hun Lim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transfer device includes a transfer unit ...