ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,577, issued on April 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Fan-out semiconductor package" was invented by Joonsung Kim (Suwon-si, South Korea) and Seokwon Lee (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out semiconductor package includes: a package body including a fan-in area corresponding to a through-hole located therein, a fan-out area surrounding the fan-in area, and a body interconnect structure arranged in the package body corresponding to the fan-out area; a fan-in chip structure located in the through-hole, the fan-in chip structure comprising a first chip, a capacitor chip ar...