US Patent Issued to SAMSUNG ELECTRONICS on April 22 for "Electronic device including thermal interface material layer and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,576, issued on April 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device including thermal interface material layer and semiconductor package" was invented by Yongha Kim (Seongnam-si, South Korea), Bonggyu Kang (Yongin-si, South Korea) and Youngsoo Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a substrate, a first plate having a first internal surface facing a first surface of the substrate, and at least one first through-hole and at least one second through-hole, first and second semiconductor packages spaced apart from each other between the first su...