US Patent Issued to SAMSUNG ELECTRONICS on April 15 for "Substrate transferring unit, substrate processing apparatus, and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,133, issued on April 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate transferring unit, substrate processing apparatus, and substrate processing method" was invented by Sangjine Park (Suwon-si, South Korea), Kuntack Lee (Suwon-si, South Korea), Jihwan Park (Hwaseong-si, South Korea) and Seungmin Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the subs...