US Patent Issued to SAMSUNG ELECTRONICS on April 15 for "Semiconductor packages having wiring patterns" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,191, issued on April 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages having wiring patterns" was invented by Youngchan Ko (Seoul, South Korea), Myungsam Kang (Hwaseong-si, South Korea), Jeongseok Kim (Cheonan-si, South Korea) and Bongju Cho (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower redistribution structure including a wiring layer, and a via connected to the wiring layer; a semiconductor chip on the lower redistribution structure; wiring patterns disposed on the lower redistribution structure and extending in a horizontal directio...