US Patent Issued to SAMSUNG ELECTRONICS on April 15 for "Semiconductor device and stack of semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,408, issued on April 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device and stack of semiconductor chips" was invented by Shaofeng Ding (Suwon-si, South Korea), Jeong Hoon Ahn (Seongnam-si, South Korea) and Yun Ki Choi (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer on the dummy transistor, the intermediate connection layer including a connection pattern electrically connected to the dummy transistor, a fir...