ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,371, issued on April 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Printed circuit board assembly and electronic device comprising same" was invented by Gyeongmin Jin (Suwon-si, South Korea), Jichul Kim (Suwon-si, South Korea), Yongjae Song (Suwon-si, South Korea), Jaeyeon Ra (Suwon-si, South Korea) and Chagyu Song (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the s...