US Patent Issued to SAMSUNG ELECTRONICS on April 15 for "Image sensor package and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,248, issued on April 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Image sensor package and method of fabricating the same" was invented by Bongjin Son (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an image sensor package with improved reliability and a method of fabricating the same. The image sensor package includes a package substrate, an image sensor chip mounted on the package substrate, a transparent cover on the image sensor chip, an encapsulant encapsulating the image sensor chip and covering a side surface of the transparent cover, a dam on a surface of the image sensor chip...