US Patent Issued to SAMSUNG ELECTRONICS, WILL TECHNOLOGY on Nov. 11 for "Probe card and semiconductor test method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,952, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and WILL TECHNOLOGY Co. LTD. (Suwon-si, South Korea).

"Probe card and semiconductor test method using the same" was invented by Byungwook Choi (Seoul, South Korea) and Seong Yeon Wi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a probe card including a lower plate, an upper plate spaced apart from the lower plate, and a needle that extends vertically to penetrate the lower plate and the upper plate, wherein the needle includes a first member that extends vertically and includes a first material, and a second member horizon...