ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,838, issued on Aug. 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and TECHNICAL COATING SOLUTION LINE-X Co. LTD. (Hwaseong-si, South Korea).
"Insulation structure, insulated piping device including the same, and method of fabricating the same" was invented by Dongwan Kim (Suwon-si, South Korea), Jeong-Hyun Kim (Pyeongtaek-si, South Korea), Seung-Hyeok An (Hwaseong-si, South Korea), Saya Lee (Osan-si, South Korea), Yoong Chung (Suwon-si, South Korea), Jiho Jeon (Yeosu-si, South Korea), Yongjun Cho (Pyeongtaek-si, South Korea) and Injun Choi (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Insulation ...