ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,455,510, issued on Oct. 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea) and Seoul National University R&DB Foundation (South Korea).

"Substrate processing apparatus and method of manufacturing semiconductor device using the same" was invented by Kyoungwhan Oh (Suwon-si, South Korea), Ho Young Kim (Seoul, South Korea), Sunghwan Kim (Suwon-si, South Korea), Jaekyung Park (Seoul, South Korea), Jaehong Lee (Suwon-si, South Korea) and Yohan Choe (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a substrate stage configured to support a semiconductor substrate, the substrate stage be...