US Patent Issued to SAMSUNG ELECTRONICS, Research & Business Foundation Sungkyunkwan University on June 17 for "Method of forming material layer" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,357, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea) and Research & Business Foundation Sungkyunkwan University (Gyeonggi-do, South Korea).

"Method of forming material layer" was invented by Kyung-Eun Byun (Seongnam-si, South Korea), Sangwoo Kim (Yongin-si, South Korea), Minsu Seol (Seoul, South Korea), Hyeonjin Shin (Suwon-si, South Korea), Minseok Shin (Suwon-si, South Korea), Pin Zhao (Suwon-si, South Korea), Taehyeong Kim (Suwon-si, South Korea) and Jaehwan Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a material film includes providing a non-photosensiti...