US Patent Issued to SAMSUNG ELECTRONICS, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION on June 17 for "Method and system for inspecting semiconductor wafer and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,186, issued on June 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION (Seoul, South Korea).

"Method and system for inspecting semiconductor wafer and method of fabricating semiconductor device using the same" was invented by Q-Han Park (Seoul, South Korea), Sung Yoon Ryu (Seoul, South Korea), Seunghyeok Son (Suwon-si, South Korea), Sujin Lee (Gwangmyeong-si, South Korea), Chan Gi Jeon (Hwaseong-si, South Korea), Su-Hyun Gong (Seoul, South Korea), DongGun Lee (Seoul, South Korea) and Younghoon Sohn (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semicond...