US Patent Issued to SAMSUNG ELECTRONICS, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY on May 13 for "Adhesive composition, method for preparing the same, reticle assembly including the same, and method for fabricating reticle assembly including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,379, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Daejeon, South Korea).

"Adhesive composition, method for preparing the same, reticle assembly including the same, and method for fabricating reticle assembly including the same" was invented by Mun Ja Kim (Hwaseong-si, South Korea), Byungchul Yoo (Yongin-si, South Korea), Haeshin Lee (Daejeon, South Korea), Chang Young Jeong (Yongin-si, South Korea) and Yunhan Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition, a method for preparing the same, a reticle assem...