ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,888, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea) and IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) (Seoul, South Korea).
"Apparatus and method for measuring properties of polymer" was invented by Hansung Ryu (Suwon-si, South Korea), Haksung Kim (Seoul, South Korea), Gyunghwan Oh (Suwon-si, South Korea), Heonsu Kim (Seoul, South Korea), Dongwoon Park (Seoul, South Korea) and Jeonghyeon Baek (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for measuring properties of a thermosetting polymer includes a body having a first chamber and a second chamber eac...