US Patent Issued to SAMSUNG ELECTRONICS, INTOPS. on Feb. 3 for "Electronic device including outer housing plated with conductive member and manufacturing method therefor" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,402, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and INTOPS. Co. LTD (Anyang-si, South Korea).

"Electronic device including outer housing plated with conductive member and manufacturing method therefor" was invented by Chunghyo Jung (Suwon-si, South Korea), Wonjun Ko (Suwon-si, South Korea), Hyein Park (Suwon-si, South Korea), Yongsub Lee (Suwon-si, South Korea), Jaedeok Lim (Suwon-si, South Korea), Bumjin Cho (Suwon-si, South Korea), Chiyoung Yoon (Anyang-si, South Korea), Keunha Kim (Anyang-si, South Korea), Kyungha Koo (Suwon-si, South Korea) and Hongki Moon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Paten...