US Patent Issued to SAMSUNG ELECTRONICS, Gwangju Institute of Science and Technology on Sept. 2 for "Semiconductor fabrication apparatus and fabrication method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,841, issued on Sept. 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea) and Gwangju Institute of Science and Technology (Gwangju, South Korea).

"Semiconductor fabrication apparatus and fabrication method" was invented by Myoung-Kyu Oh (Gwangju, South Korea), Gyehoon Kwak (Anyang-si, South Korea), Junguk Kim (Hwaseong-si, South Korea) and Hyeonju Kim (Gwangju, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor fabrication apparatus comprises a process chamber, an ozone supply that provides the process chamber with ozone, an oxygen supply that provides the ozone supply with a source gas of the ozone, and a ...