US Patent Issued to SAMSUNG ELECTRONICS, FINE SEMITECH on April 22 for "Method of removing an adhesive for an EUV mask and method of reusing an EUV mask" (South Korean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,243, issued on April 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and FINE SEMITECH CORP. (Osan-Si, South Korea).

"Method of removing an adhesive for an EUV mask and method of reusing an EUV mask" was invented by Byungchul Yoo (Yongin-si, South Korea), Byunghoon Lee (Osan-si, South Korea), Myungjun Kim (Osan-si, South Korea), Jikang Kim (Osan-si, South Korea), Jeonghwan Min (Osan-si, South Korea), Kyoungchae Seo (Osan-si, South Korea) and Changyoung Jeong (Osan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % ba...