US Patent Issued to SAMSUNG ELECTRONICS, EO Technics on Jan. 13 for "Laser annealing system and method of fabricating a semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,819, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and EO Technics Co. Ltd. (Anyang-si, South Korea).

"Laser annealing system and method of fabricating a semiconductor device using the same" was invented by Seongkeun Cho (Suwon-si, South Korea) and Hyukjun Kwon (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a laser annealing system and a method of fabricating a semiconductor device using the same. The laser annealing system having multiple laser devices may include a stage, on which a substrate is loaded, a light source generating a plurality of laser beams to be provide...