US Patent Issued to SAMSUNG ELECTRONICS, ADEKA on Nov. 18 for "Organometallic compound and method of manufacturing integrated circuit using the same" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,309, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. and ADEKA Corp. (Tokyo).

"Organometallic compound and method of manufacturing integrated circuit using the same" was invented by Seungmin Ryu (Hwaseong-si, South Korea), Younsoo Kim (Yongin-si, South Korea), Gyuhee Park (Hwaseong-si, South Korea), Younjoung Cho (Hwaseong-si, South Korea), Yutaro Aoki (Tokyo), Wakana Fuse (Tokyo), Kazuki Harano (Tokyo), Takanori Koide (Tokyo), Yoshiki Manabe (Tokyo), Kazuya Saito (Tokyo) and Hiroyuki Uchiuzou (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An organometallic compound and a method of manufacturing an integrated circuit (IC) devi...