US Patent Issued to Samsung Electronic on Oct. 21 for "Heat dissipation structure and electronic device including same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,058, issued on Oct. 21, was assigned to Samsung Electronic Co. Ltd. (Suwon-si, South Korea).

"Heat dissipation structure and electronic device including same" was invented by Taewook Ham (Suwon-si, South Korea), Moonhyung Kwon (Suwon-si, South Korea), Min Park (Suwon-si, South Korea), Younggirl Yun (Suwon-si, South Korea) and Taekkyun Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit...