ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,167, issued on Sept. 23, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and manufacturing method for the same" was invented by Soo Yun Kim (Suwon-si, South Korea) and Jung Soo Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole fr...