US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 23 for "Multilayer electronic component and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,384, issued on Sept. 23, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method of manufacturing the same" was invented by Won Jun Na (Suwon-si, South Korea), Yun Sung Kang (Suwon-si, South Korea), Hoe Chul Jung (Suwon-si, South Korea), Sun Hwa Kim (Suwon-si, South Korea) and Byeong Gyu Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on the body, wherein the internal electrode includes Ni, Sr, a...