US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 23 for "Method of manufacturing printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,165, issued on Sept. 23, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Method of manufacturing printed circuit board" was invented by Chan Jin Park (Suwon-si, South Korea), Jong Eun Park (Suwon-si, South Korea), Hyun Seok Yang (Suwon-si, South Korea), Sangik Cho (Suwon-si, South Korea), Hiroki Okada (Suwon-si, South Korea), Young Ook Cho (Suwon-si, South Korea), Mi Jeong Jeon (Suwon-si, South Korea) and In Jae Chung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apa...