US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 2 for "Printed circuit board and electronic component package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,918, issued on Sept. 2, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and electronic component package" was invented by Suk Chang Hong (Suwon-si, South Korea), Yong Duk Lee (Suwon-si, South Korea), Sang Hoon Kim (Suwon-si, South Korea), Ki Gon Kim (Suwon-si, South Korea), Woo Jeong Choi (Suwon-si, South Korea) and Cheol Min Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a substrate layer in which a plurality of insulating layers and a plurality of wiring patterns are repeatedly layered, the substrate layer including a conductive via lay...