ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,882, issued on Sept. 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Ho In Jun (Suwon-si, South Korea), Byung Jun Jeon (Suwon-si, South Korea), Yong Won Seo (Suwon-si, South Korea), Chae Min Park (Suwon-si, South Korea), Hyung Duk Yun (Suwon-si, South Korea) and A Ra Cho (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode ...