ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,871, issued on Sept. 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Coil component" was invented by Dong Hwan Lee (Suwon-si, South Korea), Hye Yeon Cha (Suwon-si, South Korea), Chan Yoon (Suwon-si, South Korea), Dong Jin Lee (Suwon-si, South Korea) and Hwi Dae Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A coil component includes a body having an upper surface and a lower surface opposing each other in a thickness direction, a support substrate disposed in the body and having one surface perpendicular to the lower surface of the body, a coil portion disposed on the support substrate, an...