ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,579, issued on Oct. 28, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jung Won Park (Suwon-si, South Korea), Hyung Jong Choi (Suwon-si, South Korea), So Jung An (Suwon-si, South Korea), Yoo Jeong Lee (Suwon-si, South Korea), Kwang Yeun Won (Suwon-si, South Korea), Woo Kyung Sung (Suwon-si, South Korea), Byung Jun Jeon (Suwon-si, South Korea) and Chul Seung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an inter...