ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,012, issued on Oct. 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and method of manufacturing the same" was invented by Do Jae Yoo (Suwon-si, South Korea), Yong Gil Namgung (Suwon-si, South Korea), Jong Hoon Shin (Suwon-si, South Korea), Won Ju Jang (Suwon-si, South Korea) and Yun Hwan Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder re...