US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 21 for "Printed circuit board and electronic component package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,418, issued on Oct. 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and electronic component package including the same" was invented by Young Kuk Ko (Suwon-si, South Korea), Chi Won Hwang (Suwon-si, South Korea) and Sang Hoon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a first insulating layer having at least one recess portion in one surface thereof; a first wiring layer embedded in one surface of the first insulating layer; and a first via layer including a first via penetrating through at least a portion of the first insulating ...