US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 21 for "Multilayer electronic component containing coated conductive particles and method of manufacturing the multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,294, issued on Oct. 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component containing coated conductive particles and method of manufacturing the multilayer electronic component" was invented by Young Ah Song (Suwon-si, South Korea), Bong Gyu Choi (Suwon-si, South Korea) and Kwang Dong Seong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes disposed to oppose each other with the dielectric layers interposed therebetween; and external electrodes connected to ...