ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,540, issued on Oct. 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component with curved side surfaces" was invented by Chang Ho Seo (Suwon-si, South Korea) and Sung Kwon An (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a multilayer electronic component includes forming a ceramic laminate in which a plurality of ceramic green sheets and a plurality of internal electrode patterns are stacked in a first direction; cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irra...