ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,541, issued on Oct. 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Chung Yeol Lee (Suwon-si, South Korea), Jun Il Kang (Suwon-si, South Korea), Hee Jung Jung (Suwon-si, South Korea), Jong Rock Lee (Suwon-si, South Korea), Cheong Kim (Suwon-si, South Korea) and Hiroki Okada (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arrang...