ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,148, issued on Nov. 25, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board" was invented by Jin Uk Lee (Suwon-si, South Korea), Chi Won Hwang (Suwon-si, South Korea) and Eun Sun Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connecte...