US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Nov. 25 for "Multilayer electronic component and method of manufacturing multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,603, issued on Nov. 25, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method of manufacturing multilayer electronic component" was invented by Hoe Chul Jung (Suwon-si, South Korea), Yun Sung Kang (Suwon-si, South Korea), Sun Hwa Kim (Suwon-si, South Korea), Byeong Gyu Park (Suwon-si, South Korea), Won Jun Na (Suwon-si, South Korea) and Doo Young Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external...