ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,656, issued on Nov. 18, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and method of manufacturing the same" was invented by Jae Ho Shin (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the fi...