ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,045, issued on Nov. 18, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Eun Jung Lee (Suwon-si, South Korea), Hyun Sik Chae (Suwon-si, South Korea), Sun Mi Kim (Suwon-si, South Korea), Dong Jun Jung (Suwon-si, South Korea) and Jong Ho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third...