ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,642, issued on Nov. 11, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Dae Hee Lee (Suwon-si, South Korea), Seung Min Kang (Suwon-si, South Korea), Hong Seok Kim (Suwon-si, South Korea) and Chang Hak Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first...