ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,264, issued on May 6, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Thermoelectric module and method for manufacturing the same" was invented by Sung Han Kim (Suwon-si, South Korea), Se Yeon Hwang (Suwon-si, South Korea), Joon Woo Gi (Suwon-si, South Korea), Jong Ho Chung (Suwon-si, South Korea) and Han Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type ...