US Patent Issued to SAMSUNG ELECTRO-MECHANICS on May 6 for "Printed circuit board including bonding layer, having conductive particles, disposed between core portions" (South Korean Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,100, issued on May 6, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board including bonding layer, having conductive particles, disposed between core portions" was invented by Sang Yoon Lee (Suwon-si, South Korea) and Seung Eun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the...