US Patent Issued to SAMSUNG ELECTRO-MECHANICS on May 27 for "Multilayer electronic component having improved high temperature load life and moisture resistance reliability" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,677, issued on May 27, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component having improved high temperature load life and moisture resistance reliability" was invented by Dong Jun Jung (Suwon-si, South Korea), Yun Kim (Suwon-si, South Korea), Hyun Kim (Suwon-si, South Korea), Sim Chung Kang (Suwon-si, South Korea) and Eun Jung Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to ...