ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,923, issued on May 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and method for manufacturing the same" was invented by Sang Hoon Kim (Suwon-si, South Korea), Young Kuk Ko (Suwon-si, South Korea), Gyu Mook Kim (Suwon-si, South Korea), Hea Sung Kim (Suwon-si, South Korea), Chi Won Hwang (Suwon-si, South Korea) and Suk Chang Hong (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating memb...