US Patent Issued to SAMSUNG ELECTRO-MECHANICS on May 20 for "Connection structure embedded substrate and substrate structure including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,924, issued on May 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Connection structure embedded substrate and substrate structure including the same" was invented by Tae Hong Min (Suwon-si, South Korea), Ho Hyung Ham (Suwon-si, South Korea), Yong Soon Jang (Suwon-si, South Korea), Ki Suk Kim (Suwon-si, South Korea), Hyung Ki Lee (Suwon-si, South Korea) and Chi Won Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively di...