US Patent Issued to SAMSUNG ELECTRO-MECHANICS on March 25 for "Reprint apparatus for circuit board and reprint method using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,477, issued on March 25, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Reprint apparatus for circuit board and reprint method using the same" was invented by Do Jae Yoo (Suwon-si, South Korea), Yong Gil Namgung (Suwon-si, South Korea), Jong Hoon Shin (Suwon-si, South Korea), Sang Soon Choi (Suwon-si, South Korea) and Young Chul An (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective ...